Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 214, Issue 1, Pages 13-20Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2013.07.013
Keywords
Sn-based solder alloys; Undercooling; Solidification; Microstructure; Ultrasonic; EBSD
Funding
- State Key Laboratory of Advanced Welding and joining, Harbin Institute of Technology [AWPT-M09]
- Natural Science Foundation of China [NSFC 51005057]
- SRF for RoCS, SEM
- Shenzhen government [CXB201105100075A, KQC201105300005A]
- [HIT.NSFIR.2010135]
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A comparative study on the microstructures of Sn-Ag-Cu alloy ingots grown by ultrasound-assisted solidification was carried out with a specific focus on the limits on the ultrasonic processing depth and time imposed by the cooling rate during the melt solidification. During air-cooling, increasing the ultrasonic power reduced the undercooling temperature and increased the solidification time, leading to beta-Sn phase fragmentation from a dendritic shape into a circular equiaxed shape. The grain size was decreased from approximately 300 mu m to 20 mu m. When the cooling rate was increased from 4 C/s in air to 20 C/s in water, the macro-undercooling temperature was more greatly reduced by an increase in ultrasonic power, but the solidification time seemed to change only slightly because only a limited period for ultrasonic processing was permitted in the melt. Under both cooling rates, the microstructures were inhomogeneous along the processing depth. The functional depth and period for ultrasonic cavitation and acoustic steaming contributed to the differences in the solidification microstructures. (C) 2013 Elsevier B.V. All rights reserved.
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