Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 214, Issue 12, Pages 3158-3168Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2014.07.028
Keywords
TLP bonding; Ti-6Al-4V alloy; Mg-AZ31 alloy; Microstructure; Scanning electron microscopy (SEM); Bonding temperature; Bonding time; Bonding pressure
Funding
- German Jordanian University (GJU)
- NSERC Canada
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Transient liquid phase (TLP) bonding of Mg-AZ31 and Ti-6Al-4V alloys was performed using pure thin Ni electro-deposited coat interlayer (12 mu m). The effect of bonding temperature, time and pressure on microstructural developments and subsequent mechanical properties across joint interface was studied at a temperature range from 500 to 540 degrees C, bonding time from 1 to 60 min and bonding pressure from 0 to 0.8 MPa. The mechanisms of bond formation varied across the joint region, with solid-state diffusion dominant at the Ti-6Al-4V interface and eutectic diffusion at the Mg-AZ31 interface. Joint microstructure was examined by scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS). X-ray diffraction (XRD) was used to detect the formation of intermetallic phases at the fracture surface. The maximum joint shear strength of 61 MPa was obtained at a temperature of 520 degrees C, 20 min and at a bonding pressure of 0.2 MPa. This joint strength was three times the bond strength reported for joints made using adhesives and represents 50% of the Mg-AZ31 alloy shear strength. (C) 2014 Elsevier B.V. All rights reserved.
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