Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 213, Issue 3, Pages 487-494Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2012.10.001
Keywords
Hydrostatic extrusion; Diffusion bonding; Thickness of diffusion layer; Regression equation; Interface hardness
Funding
- Fundamental R&D Program for Core Technology of Materials [10037206]
- Ministry of Knowledge Economy, Republic of Korea
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In this study, intermetallic compound formation at the interface between aluminum and copper during hydrostatic extrusion was simulated by performing a solid state diffusion bonding experiment with various processing parameters, including bonding temperature and pressure and holding time, and by inserting an Ag colloid layer between the aluminum and copper. Regression equations were developed to predict thickness of diffusion layer and interface hardness. An intermetallic compound formed at the interface between the Al and Cu during diffusion bonding at 420 degrees C and 240 MPa for 60 min, and it was effectively controlled by inserting an Ag colloid. These experimental data will be useful for setting up processing parameters to prepare Al/Cu matrix composite materials by using hydrostatic extrusion. (C) 2012 Elsevier B.V. All rights reserved.
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