Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 212, Issue 11, Pages 2315-2320Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2012.06.022
Keywords
Multilayer microfluidic chip; Embedded sacrificial layer; Laser edge welding; PMMA
Funding
- National Natural Science Foundation of China [51105060, 91023017, 20890024, 91023046]
- National High Technology Research and Development Program of China [2012AA040406]
- National Basic Research Program of China [2007CB714502]
- China Postdoctoral Science Foundation [20100481237, 201104601]
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Reservoir unsealed and boundary layer separation are two main issues in the fabrication of a multilayer poly(methyl methacrylate) (PMMA) microfluidic chip. In this paper, embedded sacrificial layer bonding (ESLB) and laser edge welding (LEW) are presented to avoid them. ESLB is performed by inserting a sacrificial-layer into a reservoir to enhance the transfer of bonding pressure among different layers. LEW is performed by using CO2 laser to weld the edge of a bonded multilayer chip. By using these two methods, a three-layer microchip and a five layer micro-mixer are fabricated. Our results demonstrated that ESLB and LEW can be implemented readily in the fabrication of a multilayer thermoplastic microfluidic chip which may facilitate the development of sophisticated microfluidic systems. (C) 2012 Elsevier B.V. All rights reserved.
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