Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 210, Issue 3, Pages 560-563Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2009.11.003
Keywords
Copper; Cold roll bonding; Peel strength
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Roll bonding widely used in manufacturing large layered composite sheets, is a solid phase method for bonding similar or dissimilar metals by rolling. In this study, the effects of process parameters such as rolling reduction, rolling temperature, rolling speed, initial thickness of strip, and surface roughness oil the bond strength between two-layer strips of Cu/Cu were investigated. The strips were Subjected to chemical and mechanical cleaning prior to rolling, and after rolling, bond strengths were measured using the peeling test. It was observed that increased reduction, rolling temperature, strip width, and Surface toughness led to ail increase in peeling strength while increased rolling speed and initial thickness of strips caused peeling strength to decrease. Results also showed that increasing the initial thickness of strips would increase threshold deformation. (C) 2009 Elsevier B.V. All rights reserved.
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