Journal
JOURNAL OF MATERIALS CHEMISTRY
Volume 22, Issue 26, Pages 12997-13001Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c2jm31979a
Keywords
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Funding
- Canadian Research Chairs (CRC) program, National Sciences and Engineering Research Council (NSERC)
- State Scholarship Fund of China [2010640009]
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Heat-sensitive components packaging requires low temperature joining technology. The present study considers the feasibility of room-temperature pressureless joining of copper wires using silver nanowire paste. These joints achieve a tensile strength of 5.7 MPa and exhibit ultralow resistivity in the range of 101 n Omega m. An in situ cleaning action of PVP is proposed during the bonding process.
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