Journal
JOURNAL OF LIGHTWAVE TECHNOLOGY
Volume 32, Issue 7, Pages 1329-1336Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2014.2304305
Keywords
Hybrid integration; inter-chip optical interconnects; light sources on silicon platform; quantum dot laser; silicon optical interposer; silicon photonics; spot-size converter
Funding
- Japan Society for the Promotion of Science through the Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST Program)
- Council for Science and Technology Policy
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This paper reports a hybrid integrated light source fabricated on a Si platform using a spot-size converter (SSC) with a trident Si waveguide. Low-loss coupling for 1.55 mu m and 1.3 mu m wavelengths was achieved with merely the simple planar form of a Si waveguide with no use of complicated structures such as vertical tapers or an extra dielectric core overlaid on the waveguide. The coupling loss tolerance up to a 1 dB loss increase was larger than the accuracy of our passive alignment technology. The coupling efficiency was quite robust against manufacturing variations in the waveguide width compared with that of a conventional SSC with an inverse taper waveguide. A multi-channel light source with highly uniform output power and a high-temperature light source were fabricated with a 1.55 mu m quantum well laser and a 1.3 mu m quantum dot laser, respectively. The integration scheme we report can be used to fabricate light sources for high-density, multi-channel Si optical interposers.
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