Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 135, Issue 1, Pages -Publisher
ASME
DOI: 10.1115/1.4007160
Keywords
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Funding
- Office of Naval Research [N000140710633]
- UTEP Louise Stokes Alliance for Minority Participation program
- National Science Foundation [HRD-0703584]
- National Research Foundation of Korea (NRF)
- Ministry of Education, Science and Technology [20100013209]
- Direct For Education and Human Resources
- Division Of Human Resource Development [1139929] Funding Source: National Science Foundation
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This research focused on extending the applications of fused deposition modeling (FDM) by extrusion and deposition of low melting temperature metal alloys to create three-dimensional metal structures and single-layer contacts which may prove useful for electronic interconnects. Six commercially available low melting temperature solder alloys (Bi36Pb32Sn31Ag1, Bi58Sn42, Sn63Pb37, Sn50Pb50, Sn60Bi40, Sn96.5Ag3.5) were tested for the creation of a fused deposition modeling for metals (FDMm) system with special attention given to Sn-Bi solders. An existing FDM 3000 was used and two alloys were successfully extruded through the system's extrusion head. Deposition was achieved through specific modifications to system toolpath commands and a comparison of solders with eutectic and non-eutectic compositions is discussed. The modifications demonstrate the ability to extrude simple single-layer solder lines with varying thicknesses, including sharp 90 deg angles and smooth curved lines and showing the possibility of using this system for printed circuit board applications in which various connections need to be processed. Deposition parameters altered for extrusion and the deposition results of low melting temperature metal alloys are introduced.
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