Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 43, Issue 11, Pages 3885-3897Publisher
SPRINGER
DOI: 10.1007/s11664-014-3322-z
Keywords
ENEPIG; surface finishes; reliability; solder interconnects
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Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a universal finish for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended.
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