Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 41, Issue 7, Pages 1886-1892Publisher
SPRINGER
DOI: 10.1007/s11664-012-2008-7
Keywords
Cu-Ag mixed NPs; lead-free; low-temperature bonding; electronics packaging
Categories
Funding
- National Natural Science Foundation of China [51075232]
- Tsinghua University [2010THZ 02-1]
Ask authors/readers for more resources
A simple method has been proposed to prepare polymer-protected Cu-Ag mixed nanoparticles (NPs), which are suitable for use as low-temperature bonding materials. The polymer coated on the Cu-Ag mixed NPs can protect them from oxidation effectively when heated in air at temperature lower than 280A degrees C. The low-temperature bonding process utilizing Cu-Ag mixed NPs as the bonding material is investigated. The bonding experiments show that robust joints are formed using Cu-Ag mixed NPs at 160A degrees C in air. The shear test shows that addition of copper to silver is helpful for improving joint strength. This novel sintering-bonding technology using Cu-Ag mixed NPs as an interconnection material has potential for application in the electronics packaging industry.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available