Enhancement of Thermoelectric Figure of Merit for Bi0.5Sb1.5Te3 by Metal Nanoparticle Decoration

Introducing nanoinclusions in thermoelectric (TE) materials is expected to lower the lattice thermal conductivity by intensifying the phonon scattering effect, thus enhancing their TE figure of merit . We report a novel method of fabricating Bi0.5Sb1.5Te3 nanocomposite with nanoscale metal particles by using metal acetate precursor, which is low cost and facile to scale up for mass production. Ag and Cu particles of similar to 40 nm were successfully near-monodispersed at grain boundaries of Bi0.5Sb1.5Te3 matrix. The well-dispersed metal nanoparticles reduce the lattice thermal conductivity extensively, while enhancing the power factor. Consequently, was enhanced by more than 25% near room temperature and by more than 300% at 520 K compared with a Bi0.5Sb1.5Te3 reference sample. The peak of 1.35 was achieved at 400 K for 0.1 wt.% Cu-decorated Bi0.5Sb1.5Te3.