Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 39, Issue 9, Pages 1755-1759Publisher
SPRINGER
DOI: 10.1007/s11664-010-1187-3
Keywords
Thermoelectric thick films; (Bi,Sb)(2)(Te,Se)(3)-based thermoelectric pastes; screen-printing
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In major applications, optimal power will be achieved when thermoelectric films are at least 100 mu m thick. In this paper we demonstrate that screen-printing is an ideal method to deposit around 100 mu m of (Bi,Sb)(2)(Te,Se)(3)-based films on a rigid or flexible substrate with high Seebeck coefficient value (90 mu V K-1 to 160 mu V K-1) using a low-temperature process. Conductive films have been obtained after laser annealing and led to acceptable thermoelectric performance with a power factor of 0.06 mu W K-2 cm(-1). While these initial material properties are not at the level of bulk materials, the complete manufacturing process is cost-effective, compatible with large surfaces, and affords a mass-production technique.
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