Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 40, Issue 5, Pages 992-998Publisher
SPRINGER
DOI: 10.1007/s11664-010-1476-x
Keywords
Bismuth telluride; thermoelectric; nanodispersion; silicon carbide
Categories
Funding
- 973 Program [2007CB607505]
- Natural Science Foundation of China [50820145203]
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Polycrystalline p-type Bi0.5Sb1.5Te3 and n-type Bi2Te2.7Se0.3 thermoelectric (TE) alloys containing a small amount (vol.% a parts per thousand currency sign5) of SiC nanoparticles were fabricated by mechanical alloying and spark plasma sintering. It was revealed that the effects of SiC addition on TE properties can be different between p-type and n-type Bi2Te3-based alloys. SiC addition slightly increased the power factor of the p-type materials by decreasing both the electrical resistivity (rho) and Seebeck coefficient (alpha), but decreased the power factor of n-type materials by increasing both rho and alpha. Regardless of the conductivity type, the thermal conductivity was reduced by dispersing SiC nanoparticles in the Bi2Te3-based alloy matrix. As a result, a small amount (0.1 vol.%) of SiC addition increased the maximum dimensionless figure of merit (ZT (max)) of the p-type Bi0.5Sb1.5Te3 alloys from 0.88 for the SiC-free sample to 0.97 at 323 K, though no improvement in TE performance was obtained in the case of n-type Bi2Te2.7Se0.3 alloys. Importantly, the SiC-dispersed alloys showed better mechanical properties, which can improve material machinability and device reliability.
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