4.5 Article

Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements

Journal

JOURNAL OF ELECTRONIC MATERIALS
Volume 39, Issue 1, Pages 105-108

Publisher

SPRINGER
DOI: 10.1007/s11664-009-0958-1

Keywords

Metal and alloys; lead-free solders; aging; phase transformations; tin pest; chemical analysis

Funding

  1. Austrian Science Foundation (FWF) [P 17346]

Ask authors/readers for more resources

Two samples of Sn-0.5Cu solder alloys, stored at -18A degrees C for 7 years, were chemically analyzed by an inductively coupled plasma-optical emission spectroscopy method. One of the samples was unaffected by this exposure; the other one had completely transformed into brittle alpha-Sn. Ten elements were found to exhibit statistically significant differences in their concentrations between the two samples, with the higher always associated with the untransformed sample. The highest concentrations were found for elements with an appreciable solubility in Sn, i.e., Bi, In, Pb, and Sb.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.5
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available