Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 38, Issue 1, Pages 164-174Publisher
SPRINGER
DOI: 10.1007/s11664-008-0571-8
Keywords
High-temperature electronics; passive component; system integration; packaging; ceramic substrate
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One of the most attractive ways to increase power handling capacity in power modules is to increase the operating temperature using wide-band-gap semiconductors. Ceramics are ideal candidates for use as substrates in high-power high-temperature electronic devices. The present article aims to determine the most suitable ceramic material for this application.
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