Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 37, Issue 7, Pages 1012-1019Publisher
SPRINGER
DOI: 10.1007/s11664-008-0445-0
Keywords
lead-free solders; tensile properties; strain rate sensitivity; activation energy; elongation
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The tensile properties of Sn-3Ag-0.5Cu, Sn-3.5Ag, and Sn-0.7Cu lead-free solders were investigated on small-scale specimens and compared with those of Sn-37Pb eutectic solder at various strain rates from 1 x 10(-4) s(-1) to 1 x 10(-2) s(-1) and over a wide temperature range from 25 degrees C to 150 degrees C. The tests were under true strain-rate-controlled conditions. The ductility of each lead-free solder is relatively constant while that for Sn-Pb eutectic solder strongly depends on strain rate and temperature. The strain rate sensitivity index m for lead-free solders is relatively stable and showed little dependence on temperature, whereas the values of m for Sn-37Pb increased linearly with increasing temperature.
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