4.4 Article Proceedings Paper

Characterization of stacking faults in thick 3C-SiC crystals using high-resolution diffuse X-ray scattering

Journal

JOURNAL OF CRYSTAL GROWTH
Volume 310, Issue 5, Pages 982-987

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ELSEVIER
DOI: 10.1016/j.jcrysgro.2007.11.149

Keywords

high resolution X-ray diffraction; defects; silicon carbide; single crystal growth

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A novel non-destructive method to characterize stacking faults (SFs) in 3C-SiC crystals is presented. This method is based on fast X-ray diffraction reciprocal space mapping and can be used qualitatively for routine analysis of 3C-SiC as SFs give rise to a characteristic star-like pattern in reciprocal space whose intensity depends on the SF density. The simulation of the diffusely scattered intensity streaks with an appropriate model also enables one to obtain quantitative results such as SF densities, mosaic domain size and mosaicity. The model is tested with a commercial (0 0 1) 3C-SiC crystal from HAST corporation, and then it is used to analyze SFs in (1 1 1) 3C-SiC crystals grown by continuous feed-physical vapor transport. (C) 2007 Elsevier B.V. All rights reserved.

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