4.7 Article

Wetting transition and optimal design for microstructured surfaces with hydrophobic and hydrophilic materials

Journal

JOURNAL OF COLLOID AND INTERFACE SCIENCE
Volume 336, Issue 1, Pages 298-303

Publisher

ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jcis.2009.04.022

Keywords

Wetting transition; Microstructure; Soft lithography; Replica molding; Capillary force; Polymer

Funding

  1. Korea Ministry of Knowledge Economy [10030046]
  2. Korean Government (MOEHRD) [KRF-J03003]
  3. Micro Thermal System Research Center
  4. Engineering Research institute
  5. Korea Institute of Industrial Technology(KITECH) [10030046] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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We present wetting transition of a water droplet on microstructured polymer surfaces using materials with different hydrophilicity or hydrophobicity: hydrophobic polydimethyl siloxane (PDMS) (theta(water) similar to 110 degrees) and hydrophilic Norland Optical Adhesive (NOA) (theta(water) similar to 70 degrees). The microstructures were fabricated by replica molding and self-replication with varying pillar geometry [diameter: 5 mu m, spacing-to-diameter ratio (s/d): 1-10 (equal interval), height-to-diameter ratio (h/d): 1-5] over an area of 100 mm(2) (10 mm x 10 mm). Measurements of contact angle (CA) and contact angle hysteresis (CAH) demonstrated that wetting state was either in the homogeneous Cassie regime or in the mixed regime of Cassie and Wenzel states depending on the values of s/d and h/d. These two ratios need to be adjusted to maintain stable superhydrophobic properties in the Cassie regime: s/d should be smaller than similar to 7 (PDMS) and similar to 6 (NOA) with h/d being larger than similar to 2 to avoid wetting transition by collapse of a water droplet into the microstructure. Based on our observations, optimal design parameters were derived to achieve robust hydrophobicity of a microstructured surface with hydrophobic and hydrophilic materials. (C) 2009 Elsevier Inc. All rights reserved.

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