Journal
JOURNAL OF APPLIED PHYSICS
Volume 104, Issue 12, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.3029704
Keywords
dielectric thin films; organic semiconductors; plasma CVD; polymer films; silicon compounds; thin film transistors
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Funding
- University of Waterloo
- Natural Sciences and Engineering Research Council (NSERC) of Canada
- Ontario Centre of Excellence (OCE)
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This paper considers plasma-enhanced chemical vapor deposited (PECVD) silicon nitride (SiNx) and silicon oxide (SiOx) as gate dielectrics for organic thin-film transistors (OTFTs), with solution-processed poly[5,5(')-bis(3-dodecyl-2-thienyl)-2,2(')-bithiophene] (PQT-12) as the active semiconductor layer. We examine transistors with SiNx films of varying composition deposited at 300 degrees C as well as 150 degrees C for plastic compatibility. The transistors show over 100% (two times) improvement in field-effect mobility as the silicon content in SiNx increases, with mobility (mu(FE)) up to 0.14 cm(2)/V s and on/off current ratio (I-ON/I-OFF) of 10(8). With PECVD SiOx gate dielectric, preliminary devices exhibit a mu(FE) of 0.4 cm(2)/V s and I-ON/I-OFF of 10(8). PQT-12 OTFTs with PECVD SiNx and SiOx gate dielectrics on flexible plastic substrates are also presented. These results demonstrate the viability of using PECVD SiNx and SiOx as gate dielectrics for OTFT circuit integration, where the low temperature and large area deposition capabilities of PECVD films are highly amenable to integration of OTFT circuits targeted for flexible and lightweight applications.
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