Journal
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME
Volume 80, Issue 4, Pages -Publisher
ASME
DOI: 10.1115/1.4007851
Keywords
transfer printing; viscoelasticity; interfacial fracture toughness; pulling speed; pull-off force
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Funding
- NSF [OISE-1043143, ECCS-0824129, CMMI-0749028]
- NSFC
- Div Of Electrical, Commun & Cyber Sys
- Directorate For Engineering [824129] Funding Source: National Science Foundation
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Transfer printing is a volatile tool to retract micro devices from a donor substrate via elastomeric stamps, from which the devices are grown or fabricated, followed by printing to a receiver substrate where the device is assembled to an array for integration in various applications. Among the five approaches of transfer printing summarized in the paper, the viscoelastic property of stamps is widely adopted to modulate the interfacial adhesion between the stamp and devices by applying different pulling speeds. A viscoelastic model for transfer printing is analytically established. It shows that the interfacial adhesion increases with pulling speed, which is verified by the experiments and numerical simulations.
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