Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 572, Issue -, Pages 97-106Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2013.03.234
Keywords
Lead-free solder alloys; Microelectronics applications; Mechanical properties; Solidification; Microstructure
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Funding
- CNPq (The Brazilian Research Council)
- Faepex/Funcamp (Foundation of the University of Campinas, Unicamp)
- FAPESP (The Scientific Research Foundation of the State of Sao Paulo, Brazil)
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The aim of this paper is to develop a comparative evaluation of mechanical properties of as-cast Sn-Bi, Sn-Ag and Sn-Zn alloys as a function of the resulting microstructural arrays with a view to application as solder materials. The resulting microstructures, ultimate and yield tensile strengths and elongations of Sn-40 wt.% Bi, Sn-3.5 wt.% Ag and Sn-9 wt.% Zn alloys were examined and compared with the corresponding results of the traditional Sn-40 wt.% Pb solder alloy. Tensile tests were carried out using specimens selected from specific positions along the length of the directionally solidified castings and Hall-Petch type correlations have been proposed relating the resulting tensile properties of each alloy to a parametric scale of the microstructure. It was found that all Pb-free alloys examined comply with a compromise between compatible mechanical strength and environmental protection. The Sn-Bi alloy has the highest ultimate tensile strength of all alloys examined, while both Sn-Ag and Sn-Zn alloys are lighter and exhibited higher ductility than the Sn-Pb and Sn-Bi alloys. (C) 2013 Elsevier B.V. All rights reserved.
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