4.7 Article

The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn-Ag lead free solder alloy

Journal

JOURNAL OF ALLOYS AND COMPOUNDS
Volume 542, Issue -, Pages 136-141

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2012.07.044

Keywords

Creep; Nanoindentation; Lead-free solder; Modified Garofalo's creep model

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The effect of addition of nano-sized Ni and Mo particles on creep behavior of Sn-3.5Ag lead free solder alloy was investigated using a constant load method in a nanoindenter. Modified Garofalo's equation was found to show an excellent fit to indentation creep data. It was observed that the steady state creep rate as well as primary creep stage displacement and primary creep stage time decreased with increasing addition of Mo and Ni to the base alloy. (C) 2012 Elsevier B. V. All rights reserved.

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