Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 520, Issue -, Pages 244-249Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2012.01.032
Keywords
Minor alloying elements; Pb-free solders; Ti addition
Categories
Funding
- National Science Council of Taiwan [NSC 99-2911-I-002-100]
- International Business Machines Corporation
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Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solder joints. In this study, a small amount of Ti was added to Sn-Cu and Sn-Ag solders, and their microstructures, solidification behaviors, mechanical properties, and high temperature aging characteristics were investigated. Thermal analysis confirmed Ti addition being very effective in reducing the undercooling. Correlations between cooling rates, microstructure, and microhardness were established. One pronounced feature of Ti addition was that Ti-added solders had microstructures very stable against extreme aging conditions. (C) 2012 Elsevier B.V. All rights reserved.
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