4.7 Article

Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy

Journal

JOURNAL OF ALLOYS AND COMPOUNDS
Volume 469, Issue 1-2, Pages 270-275

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2008.01.101

Keywords

High-temperature alloys; Microstructure; TLP bonding

Funding

  1. Sharif University of Technology

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The effect of bonding temperature on microstructure of a transient liquid phase (TLP)-bonded GTD-111 nickel base superalloy, using a Ni-Si-B interlayer, was investigated. At low bonding temperatures microstructure of the joint centerline is controlled by B diffusion. However, at high bonding temperature effect of base metal alloying elements on the joint microstructure development was more pronounced. Effects of bonding temperature on the formation of secondary precipitates in diffusion-affected zone and isothermal solidification time were also analyzed. It was found that above a critical temperature, formation of borides in diffusion-affected zone is suppressed and the time required for isothermal solidification completion is increased. (C) 2008 Elsevier B.V. All rights reserved.

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