Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 480, Issue 2, Pages 409-415Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2009.02.110
Keywords
Lead-free solders; Copper; Interaction; X-ray scan; Phase analysis
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Funding
- Slovak Grant Agencies [VEGA 2/6160/26, 2/0157/08, APVV-0413-06, APVV-0102-07]
- European COST Action [MP0602]
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Influence of indium in Sn3.13Ag0.74Cu solder containing 4, 15, 30, 50 and 75 at.% In on the microstructure at the solder/Cu interface after wetting at 523 K for 1800 s was studied. The scanning electron microscopy (SEM) combined with energy-dispersive X-ray spectroscopy (EDX), standard and spatially resolved X-ray diffraction (XRD) techniques were used to determine the phases present at the solder/Cu interface. It was found that for In concentration up to 30 at.% the interface is formed by Cu(6)Sn(5) phase. For higher In content (50 and 75 at.% In) interface consists of copper rich Cu(41)Sn(11) phase. (C) 2009 Elsevier B.V. All rights reserved.
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