4.7 Article Proceedings Paper

A comparative study of the electrochemical deposition of molybdenum oxides thin films on copper and platinum

Journal

JOURNAL OF ALLOYS AND COMPOUNDS
Volume 483, Issue 1-2, Pages 402-405

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2008.08.119

Keywords

Electrochemical reactions; Thin films; Atomic Force Microscopy-AFM

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Molybdenum oxides thin films electrochemical deposition was performed using solutions of peroxo-polymolybdate at pH 2.3 and ammonium molybdate at pH 5.5 as precursors and smooth copper and platinum as supports. The deposition has been carried out at constant potentials in the range of -600 to -800 mV vs. Ag/AgCl (sat. KCl). The thin films deposited on copper were then heated at 350 and 450 degrees C in argon. In the case of thin films deposited from ammonium molybdate and heated at 450 degrees C, the XRD spectra reveal, along with MoO2, the presence of Cu6Mo5O18 phase. For the thin films prepared from peroxo-polymolybdate and subjected to the same heat treatment, the only XRD phase present was MoO2. Thermogravimetric (TG) analysis was performed on samples prepared by scraping away the thin films (molybdate precursors) from the copper support. Before heat treatment, the AFM images of the as-deposited thin film reveal a granular morphology, with diameters in the 20-80 nm range. (C) 2008 Elsevier B.V. All rights reserved.

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