Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 468, Issue 1-2, Pages 154-157Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2008.01.019
Keywords
Lead-free solder; Intermetallics; Microstructure; Aging; Microhardness
Categories
Funding
- National Natural Science Foundation of China [50401003]
- Natural Science Foundation of Tianjin City [07JCZDJC01200]
- Keygrant Project of Chinese Ministry of Education [707012]
- Fok Ying Tong Education Foundation
- Program for New Century Excellent Talents in University
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The structural stability of the rapidly solidified eutectic Sn-3.7 wt.%Ag-0.9 wt.%Zn solder was explored by aging at room temperature (298 K). After aging for 2 weeks. the microstructure varied a lot in the Morphology of intermetallic compounds (IMCs) in the investigated Sn-Ag-Zn solder. Dot-like Ag3Sn IMCs in the rapidly solidified solder congregated and formed bulk ones in order to minimize the system energy, which is contrary to a stable microstructure in the slowly cooled specimen. It seems that the coarsening of the IMCs in the microstructure of the rapidly solidified specimen brought a significant softening during aging of the explored Sn-Ag-Zn alloy. Furthermore, with the addition of zinc, the solder system becomes harder than the eutectic Sn-Ag system and the Ag-Zn phase dispersed in the eutectic Sn-Ag-Zn solder could strengthen the system its a reinforcing secondary phase. (C) 2008 Elsevier B.V. All rights reserved.
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