Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 454, Issue 1-2, Pages 174-179Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2006.12.098
Keywords
lead-free; intermetallic compounds; reliability; thermal cycling
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The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes. (c) 2007 Elsevier B.V. All rights reserved.
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