Journal
NANOSCALE
Volume 7, Issue 16, Pages 7368-7377Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c5nr00312a
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Funding
- University of Tennessee
- NSFC [61307066]
- Doctoral Fund of Ministry of Education of China [20110092110016, 20130092120024]
- Natural Science Foundation of Jiangsu Province [BK20130630]
- National Basic Research Program of China (973 Program) [2011CB302004]
- Foundation of Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, China [201204]
- Education Commission [KZ40005001]
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Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformations observed in failure microcracks with the formation of PVP nanofibers, revealed bonding strength at low temperatures (<250 degrees C) was primarily due to adhesive bonding. It is found that, utilizing photonic sintering, similar to 70 degrees C reduction of transformation temperature from adhesive to metallic bonding was achieved compared to that of thermal sintering. A numerical simulation was developed to better understand the influences of the light-induced heat generation, which demonstrated near-infrared light can facilitate sintering. Bonding strengths of 27 MPa were achieved at room temperatures, and 29.4 MPa at 210 degrees C with photonic sintering. Moreover, the anisotropic resistivity was observed with different thermal dependences. These results demonstrate Ag nanoplate inks have potential for low temperature 3D interconnections in lead-free microcircuits, flexible electronic packaging, and diverse sensing applications.
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