4.8 Article

Using the Thickness of Graphene to Template Lateral Subnanometer Gaps between Gold Nanostructures

Journal

NANO LETTERS
Volume 15, Issue 1, Pages 635-640

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/nl504121w

Keywords

Subnanometer gap; nanogap; graphene nanoribbon; ultramicrotomy; nanoskiving; SERS

Funding

  1. University of California, San Diego
  2. SoCal Clean Energy Technology Acceleration Program from the von Liebig Center at UCSD - US Department of Energy
  3. National Science Foundation Graduate Research Fellowship Program [DGE-1144086]
  4. Calit2-Qualcomm Institute Summer Undergraduate Research Scholars program
  5. Office of Naval Research [N000141210574]
  6. DURIP grant [N000141310655]

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This work demonstrates the use of single-layer graphene as a template for the formation of subnanometer plasmonic gaps using a scalable fabrication process called nanoskiving. These gaps are formed between parallel gold nanowires in a process that first produces three-layer thin films with the architecture gold/single-layer graphene/gold, and then sections the composite films with an ultramicrotome. The structures produced can be treated as two gold nanowires separated along their entire lengths by an atomically thin graphene nanoribbon. Oxygen plasma etches the sandwiched graphene to a finite depth; this action produces a subnanometer gap near the top surface of the junction between the wires that is capable of supporting highly confined optical fields. The confinement of light is confirmed by surface-enhanced Raman spectroscopy measurements, which indicate that the enhancement of the electric field arises from the junction between the gold nanowires. These experiments demonstrate nanoskiving as a unique and easy-to-implement fabrication technique that is capable of forming subnanometer plasmonic gaps between parallel metallic nanostructures over long, macroscopic distances. These structures could be valuable for fundamental investigations as well as applications in plasmonics and molecular electronics.

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