Journal
INTERNATIONAL JOURNAL OF THERMOPHYSICS
Volume 32, Issue 5, Pages 1013-1024Publisher
SPRINGER/PLENUM PUBLISHERS
DOI: 10.1007/s10765-011-0977-z
Keywords
3 omega Method; Carbon nanotube array; Thermal boundary resistance; Thermal conductivity; Thermal impedance
Funding
- Promotive Research Fund for Excellent Young and Middle-aged Scientists [BS2009CL017]
- Natural Science Fund of Shandong Province [Y2008F42]
- Fundamental Research Funds for the Central Universities [27R0915029A]
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The thermal conductivities, thermal diffusivity, thermal anisotropy ratio, and thermal boundary resistance for the multilayered microstructure of a carbon nanotube (CNT) array are reconstructed experimentally using the 3 omega method with two different width metal heaters. The thermal impedance in the frequency domain and sensitivity coefficients are introduced to simultaneously determine the multiple thermal parameters. The thermal conductivity at 295 K is 38 W center dot m(-1) center dot K(-1) along the nanotube growth direction, and two orders of magnitude lower in the direction perpendicular to the tubes with the anisotropy ratio as large as 86. Separation of the contact and CNT array resistances is realized through circuit modeling. The measured thermal boundary resistances of the CNT array/Si substrate and insulating diamond film interfaces are 3.1 m(2) center dot K center dot MW(-1) and 18.4 m(2) center dot K center dot MW(-1), respectively. The measured thermal boundary resistance between the heater and diamond film is 0.085 m(2) center dot K center dot MW(-1) using a reference sample without a CNT array. The thermal conductivity for a CNT array already exceeds those of phase-changing thermal interface materials used in microelectronics.
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