Journal
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS
Volume 20, Issue 6, Pages 563-567Publisher
SPRINGER
DOI: 10.1007/s12613-013-0766-8
Keywords
lead-free solder; phosphorus; wettability; oxidation; corrosion
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Funding
- National Natural Science Foundation of China [50904035]
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This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn-9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-9Zn solder alloy.
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