Journal
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS
Volume 18, Issue 4, Pages 472-478Publisher
SPRINGER
DOI: 10.1007/s12613-011-0465-2
Keywords
composite materials; pressure infiltration; thermal conductivity; coefficient of thermal expansion
Categories
Funding
- National Natural Science Foundation of China [50971020]
- National High-Tech Research and Development Program of China [2008AA03Z505]
Ask authors/readers for more resources
Diamond reinforced copper (Cu/diamond) composites were prepared by pressure infiltration for their application in thermal management where both high thermal conductivity and low coefficient of thermal expansion (CTE) are important. They were characterized by the microstructure and thermal properties as a function of boron content, which is used for matrix-alloying to increase the interfacial bonding between the diamond and copper. The obtained composites show high thermal conductivity (> 660 W/(m center dot K)) and low CET (< 7.4x10(-6) K(-1)) due to the formation of the B(13)C(2) layer at the diamond-copper interface, which greatly strengthens the interfacial bonding. Thermal property measurements indicate that in the Cu-B/diamond composites, the thermal conductivity and the CTE show a different variation trend as a function of boron content, which is attributed to the thickness and distribution of the interfacial carbide layer. The CTE behavior of the present composites can be well described by Kerner's model, especially for the composites with 0.5wt% B.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available