Journal
MICROELECTRONICS RELIABILITY
Volume 55, Issue 8, Pages 1256-1261Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2015.05.012
Keywords
Ag-Pd; Wire bonding; Mechanical properties; Electrical test
Funding
- Instrument Center of National Cheng Kung University
- Ministry of Science and Technology of Taiwan [MOST 103-2221-E-006-066, 103-2221-E-006-056-MY2]
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This study investigated the mechanical and electrical properties of Ag-2Pd wire after thermal annealing. The thermal stability of the tested wire was examined by separately imposing static annealing at 275 degrees C, 325 degrees C and 375 degrees C in a vacuum environment. It was found that annealing the Ag-2Pd wire at 275 degrees C promoted the formation of a fully annealed structure with equiaxed grains. Annealing Ag-2Pd wire had a shorter heat affect zone (HAZ) length than those of conventional wire, and offered outstanding mechanical properties. A long-term electrical test found Ag-3(Pd)Al and Ag-2(Pd)Al compounds between the Ag-Pd ball and Al pad. These results confirmed the high-reliability properties of annealed Ag-2Pd wires for the wire bonding process. (C) 2015 Elsevier Ltd. All rights reserved.
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