4.4 Article

Fabrication of polarization-insensitive, multi-resonant metamaterial absorber using wafer bonding of glass dielectric substrate

Journal

MICROELECTRONIC ENGINEERING
Volume 136, Issue -, Pages 42-47

Publisher

ELSEVIER
DOI: 10.1016/j.mee.2015.04.010

Keywords

Metamaterial absorber; Polarization insensitivity; Wafer bonding; Glass dielectric substrate

Funding

  1. National Research Foundation of Korea (NRF) - Korea government (MSIP) [NRF-2012R1A2A2A01011017]

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We present the design, fabrication and characterization of a terahertz multi-resonant metamaterial absorber showing polarization-insensitive characteristics. The proposed absorber uses Pyrex glass as a dielectric layer for higher absorption in a terahertz range and is wafer-level fabricated by thermo-compression bonding technique using gold films as intermediate layers. In addition, an array of comb-shaped hexagonal pattern is introduced as a multi-band LC resonator and symmetric geometry is used for polarization insensitivity. The fabricated absorber shows two absorption peaks at 0.98 THz and 1.55 THz with the absorptivity of 93% and 74%, respectively, and almost identical responses to the different polarization angles. (C) 2015 Elsevier B.V. All rights reserved.

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