A novel high performance, ultra thin heat sink for electronics

We present an ultra thin heat sink for electronics, combining optimized impinging slot-jets, micro-channels and manifolds for efficient cooling. We first introduce a three-dimensional numerical model of the heat transfer structure, to investigate its hydrodynamic and thermal performance and its sensitivity to geometric parameters. In a second step we propose a three-dimensional hydrodynamic numerical model representing the complete system. Based on this model we design a novel manifold providing uniform fluid distribution. In order to save computational time a simpler semi-empirical model is proposed and validated. The semi-empirical model allows a robust optimization of the heat sink geometric parameters. The design is optimized for a 2 x 2 cm(2) chip and provides a total thermal resistance of 0.087 cm(2) K/W for flow rates <1 l/mm n and an overall pressure drop <0.1 bar. This results in a maximum cooling capacity of 750 W/cm(2) for a temperature difference between fluid inlet and chip of 65 K. (c) 2010 Elsevier Inc. All rights reserved.