Related references
Note: Only part of the references are listed.Microstructure and properties of bulk copper matrix composites strengthened with various kinds of graphene nanoplatelets
Jan Dutkiewicz et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2015)
Mechanical behavior and strengthening mechanisms in ultrafine grain precipitation-strengthened aluminum alloy
Kaka Ma et al.
ACTA MATERIALIA (2014)
Effect of Aluminium Additions on Wettability and Intermetallic Compound (IMC) Growth of Lead Free Sn (2 wt. % Ag, 5 wt. % Si) Soldered Joints
Hee Yul Lee et al.
ELECTRONIC MATERIALS LETTERS (2014)
Effect of Graphene Nanoplatelets addition on mechanical properties of pure aluminum using a semi-powder method
Muhammad Rashad et al.
PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL (2014)
Development of lead free pulse electrodeposited tin based composite solder coating reinforced with ex situ cerium oxide nanoparticles
Ashutosh Sharma et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2013)
Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse Electrodeposition
Ashutosh Sharma et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2013)
Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds
A. S. M. A. Haseeb et al.
MATERIALS CHARACTERIZATION (2012)
Reinforcement with graphene nanosheets in aluminum matrix composites
Jingyue Wang et al.
SCRIPTA MATERIALIA (2012)
An analysis of the factors affecting strengthening in carbon nanotube reinforced aluminum composites
Srinivasa R. Bakshi et al.
CARBON (2011)
Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads
Asit Kumar Gain et al.
MICROELECTRONICS RELIABILITY (2011)
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates
Asit Kumar Gain et al.
MICROELECTRONICS RELIABILITY (2011)
Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders
K. Mohan Kumar et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2008)
Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy
Ping Liu et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
Development of lead-free Sn-0.7Cu/Al2O3 nanocomposite solders with superior strength
X. L. Zhong et al.
JOURNAL OF PHYSICS D-APPLIED PHYSICS (2008)
Properties and deformation behaviourOf Mg-Y2O3 nanocomposites
C. S. Goh et al.
ACTA MATERIALIA (2007)
Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate
Hongqin Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2007)
Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder
J. Shen et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Improving the performance of lead-free solder reinforced with multi-walled carbon narlotubes
S. M. L. Nai et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Simultaneous enhancement in strength and ductility by reinforcing magnesium with carbon nanotubes
C. S. Goh et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Metal matrix composites - From science to technological significance
DB Miracle
COMPOSITES SCIENCE AND TECHNOLOGY (2005)
Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints
KS Kim et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2003)
Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys
KS Kim et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2002)
Time evolution of liquid drop impact onto solid, dry surfaces
R Rioboo et al.
EXPERIMENTS IN FLUIDS (2002)
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
K Zeng et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2002)
Advances in lead-free electronics soldering
K Suganuma
CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE (2001)
Lead-free solders in microelectronics
M Abtew et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2000)
Share Paper
