Journal
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Volume 46A, Issue 12, Pages 6018-6039Publisher
SPRINGER
DOI: 10.1007/s11661-015-3175-y
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Funding
- Hydro Aluminium
- Norwegian Research Council through SFI CASA - Centre for Research-Based Innovation at the Norwegian University of Science and Technology, Trondheim, Norway
- SFI MANUFACTURING - Centre for Research-Based Innovation at SINTEF Raufoss Manufacturing & the Norwegian University of Science and Technology, Raufoss, Norway
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In this article, a new age-hardening model for Al-Mg-Si alloys is presented (named NaMo-Version 2), which takes into account the combined effect of cold deformation and prolonged room-temperature storage on the subsequent response to artificial aging. As a starting point, the original physical framework of NaMo-Version 1 is revived and used as a basis for the extension. This is permissible, since a more in-depth analysis of the underlying particle-dislocation interactions confirms previous expectations that the simplifying assumption of spherical precipitates is not crucial for the final outcome of the calculations, provided that the yield strength model is calibrated against experimental data. At the same time, the implementation of the Kampmann-Wagner formalism means that the different microstructure models can be linked together in a manner that enforces solute partitioning and competition between the different hardening phases which form during aging (e.g., clusters, beta '' and beta'). In a calibrated form, NaMo-Version 2 exhibits a high degree of predictive power, as documented by comparison with experiments, using both dedicated nanostructure and yield strength data as a basis for the validation. Hence, the model is deemed to be well-suited for simulation of thermomechanical processing of Al-Mg-Si alloys involving cold-working operations like sheet forming and stretch bending in combination with heat treatment and welding. (C) The Author(s) 2015. This article is published with open access at Springerlink. com
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