4.6 Article

Effect of slurry injection position on material removal in chemical mechanical planarization

Journal

Publisher

SPRINGER LONDON LTD
DOI: 10.1007/s00170-012-4702-2

Keywords

Chemical mechanical planarization; Slurry injection position; Slurry distribution; Pressure distribution; Material removal rate

Funding

  1. National Science Fund for Distinguished Young Scholars [50825501]
  2. Science Fund for Creative Research Groups [51021064]
  3. National Natural Science Foundation of China [51205226]
  4. China Postdoctoral Science Foundation [2012M510420]

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In this paper, the effect of slurry injection position on removal rate and nonuniformity was experimentally investigated on a 300-mm polisher developed by the authors, and the effect of slurry injection position on slurry fluid pressure distribution during polishing was also measured by a novel in situ fluid pressure measurement system integrated in the polisher. In situ pad conditioning was employed in all experiments. The results showed that removal rate, nonuniformity, and fluid pressure distribution were influenced dramatically by the slurry injection position. The slurry injection position determines the slurry distribution, and therefore, the removal rate profile and fluid pressure distribution were affected.

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