Related references
Note: Only part of the references are listed.Through-Silicon Via Planning in 3-D Floorplanning
Ming-Chao Tsai et al.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS (2011)
High-Density Through Silicon Vias for 3-D LSIs
Mitsumasa Koyanagi et al.
PROCEEDINGS OF THE IEEE (2009)
Kraftwerk2 - A fast force-directed quadratic placement approach using an accurate net model
Peter Spindler et al.
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS (2008)
Edge separability based circuit clustering with application to multilevel circuit partitioning
J Cong et al.
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS (2004)