Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 645, Issue -, Pages 306-310Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2015.08.035
Keywords
Adiabatic shear band; Void; Dimple; Crack; Hot induction bending; Electron microscopy
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Funding
- National Council of Science and Technology (CONACYT) from the Mexican Government [166350]
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This study was focused on the characterization of the origin and mechanism of crack propagation as a result of hot induction bending of Ti alloy. Plates of Ti-6Al-4V alloy with 12.5 mm of thickness were submitted to hot induction bending below the beta transus temperature. Optical and scanning electron microscopy analysis showed crack formation in the tensile zone. Microstructural evidence showed that cracks propagate through the adiabatic shear bands by Dimple-Void mechanism. However, voids formation before shear banding also occurred. In both mechanisms adiabatic shear bands are formed via dynamic recrystallization where the alpha-beta interphase works as stress concentrator promoting the formation of dimples and voids. (C) 2015 Elsevier B.V. All rights reserved.
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