Journal
IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL
Volume 55, Issue 9, Pages 1900-1905Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TUFFC.881
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In this study, we report results on a piezoelectric-material-based mechanical energy-harvesting device that was fabricated by combining laser machining with microelectronics packaging technology. It was found that the laser-machining process did not have significant effect on the electrical properties of piezoelectric material. The fabricated device was tested in the low-frequency regime of 50 to 1000 Hz at constant force of 8 g (where g = 9.8m/s(2)). The device was found to generate continuous power of 1.13 mu W at 870 Hz across a 288.5 k Omega load with a power density of 301.3 mu W/cm(3).
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