Journal
IEEE TRANSACTIONS ON POWER ELECTRONICS
Volume 27, Issue 10, Pages 4347-4356Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2012.2192136
Keywords
Bonding wire; fully integrated dc-dc converter; lead frame; low-swing gate driver; packaging inductor
Categories
Funding
- Ministry of Knowledge Economy, Korea under the University ITRC [NIPA-2012-H0301-12-1007]
- Industry Strategic Technology Development Program
- Ministry Knowledge Economy, Korea [10039145]
- Korea Evaluation Institute of Industrial Technology (KEIT) [10041135, 10039145] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- Ministry of Public Safety & Security (MPSS), Republic of Korea [H0301-12-1007] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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Implementation of on-chip passive elements and efficient regulation schemes are key aspects of fully integrated dc-dc converter design. This paper presents a 50-MHz fully integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also presents full-swing and low-swing gate drivers for efficient regulation of high-frequency switching converters. The low-swing driver uses the drop voltage of a diode-connected transistor and is applied in a fabricated converter to reduce the gate driving loss caused by the high switching operation. The proposed converter is designed and fabricated using a 0.13-mu m 1-poly 6-metal CMOS process. The fully integrated buck converter achieves 68.7% and 76.8% efficiency for 3.3 V/2.0 V and 2.5 V/1.8 V conversions, respectively, while providing a load current of 250 mA.
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