Journal
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume 59, Issue 3, Pages 527-532Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMTT.2010.2090358
Keywords
Boundary conditions; composite material structures; electromagnetic (EM) analysis; EM modeling; nanostructures
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An additional boundary condition (ABC) for mushroom or bed-of-nails metamaterials is generalized for thin 3-D or 2-D material patches or ground planes. It is shown that the usual ABC necessary for the homogenization of these wire-medium metamaterials fails for thin imperfect conductors, and a generalization is presented based on charge conservation. The new ABC leads to results that are in good agreement with full-wave simulations.
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