3.8 Article

In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing

Journal

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TEPM.2008.2004570

Keywords

Acoustic temperature sensing; polymer curing; rapid curing; variable frequency microwave curing; zinc oxide deposition

Funding

  1. Office of Naval Research
  2. National Science Foundation

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Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20 degrees C to 300 degrees C with an attainable accuracy of 2 degrees.

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