4.6 Article

Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging

Journal

IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 59, Issue 12, Pages 3269-3272

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2012.2219624

Keywords

Mechanical properties; oxidation resistance; rare earth (RE); solder joints

Funding

  1. Natural Science Foundation of Jiangsu Province [BK2012144]
  2. Jiangsu Normal University Foundation [11XLR16]
  3. Provincial Key Laboratory of Advanced Welding Technology, Jiangsu University of Science and Technology Foundation [JSAWS-11-03]
  4. Natural Science Foundation of the Higher Education Institutions of Jiangsu Province [12KJB460005]

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In this paper, the effect of rare earth (RE) La on the properties of Sn9Zn solder was carried out. The results indicate that RE La plays an important role not only in the wettability and the structure of the solder but also in the mechanical property of the solder joint. The results show that adding trace amount of RE La can remarkably improve the wettability and oxidation resistance of SnZn solder and can enhance the mechanical properties of solder joints. When RE La content is 0.06%, the SnZn-based solder has the best properties. In addition, it is found that SnZn0.06La shows a finer and more uniform microstructure than SnZn, and the sizes of Zn-rich phases are obviously reduced.

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