Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 58, Issue 1, Pages 132-140Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2010.2087339
Keywords
GaN; high-electron mobility transistors (HEMTs); measurement; transient; trapping
Funding
- Army Research Laboratory through the DARPA-WBGS [W911QX-05-C-0087]
- Office of Naval Research through the DRIFT-MURI [N00014-08-1-0655]
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Trapping is one of the most deleterious effects that limit performance and reliability in GaN HEMTs. In this paper, we present a methodology to study trapping characteristics in GaN HEMTs that is based on current-transient measurements. Its uniqueness is that it is amenable to integration with electrical stress experiments in long-term reliability studies. We present the details of the measurement and analysis procedures. With this method, we have investigated the trapping and detrapping dynamics of GaN HEMTs. In particular, we examined layer location, energy level, and trapping/detrapping time constants of dominant traps. We have identified several traps inside the AlGaN barrier layer or at the surface close to the gate edge and in the GaN buffer.
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