4.6 Article

Optimized Thermal Management From a Chip to a Heat Sink for High-Power GaN-Based Light-Emitting Diodes

Journal

IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 57, Issue 9, Pages 2203-2207

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2010.2053492

Keywords

Composite solder; light-emitting diodes (LEDs); thermal resistance

Funding

  1. National Science Council of Taiwan [NSC96-2628-E-005-091-MY3, NSC98-ET-E-005-002-ET]
  2. Ministry of Economic Affairs [97-EC-17-A-07-SI-097]
  3. Electronics and Opto-electronics Research Laboratories, Industrial Technology Research Institute [99-B-08]

Ask authors/readers for more resources

To improve heat dissipation of sapphire-based LEDs, we develop a new LED package with a dual heat spreader design. The first heat spreader is a cup-shaped copper sheet, which was directly contacted with sapphire to enhance heat dissipation of the chip itself. The second heat spreader is the die-bonding material of diamond-added AgSnCu solder and a high thermal conductive metal-core printed circuit board (MCPCB), where the conventional dielectric layer was replaced with a thin diamond-like layer. Characterization results demonstrate that the diamond-added composite solder is useful in reducing LED thermal resistance, thus avoiding the thermal accumulation phenomenon. In addition, a LED packaged on the new MCPCB exhibits smaller total thermal resistance and larger light output power.

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