Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 56, Issue 11, Pages 2644-2651Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2009.2031043
Keywords
Hole mobility; hole velocity; p-MOSFET; silicon germanium; uniaxial stress
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Hole mobility and velocity are extracted from scaled strained-Si0.45Ge0.55 channel p-MOSFETs on insulator. Devices have been fabricated with sub-100-nm gate lengths, demonstrating hole mobility and velocity enhancements in strained-Si0.45Ge0.55 channel devices relative to Si. The effective hole mobility is extracted utilizing the dR/dL method. A hole mobility enhancement is observed relative to Si hole universal mobility for short-channel devices with gate lengths ranging from 65 to 150 nm. Hole velocities extracted using several different methods are compared. The hole velocity of strained-SiGe p-MOSFETs is enhanced over comparable Si control devices. The hole velocity enhancements extracted are on the order of 30%. Ballistic velocity simulations suggest that the addition of < 110 > uniaxial compressive strain to Si0.45Ge0.55 can result in a more substantial increase in velocity relative to relaxed Si.
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