Electric-Field-Driven Degradation in OFF-State Step-Stressed AlGaN/GaN High-Electron Mobility Transistors

The critical degradation voltage of AlGaN/GaN high-electron mobility transistors during OFF-state electrical stress was determined as a function of Ni/Au gate dimensions (0.1-0.17 mu m), drain bias voltage, and source/drain-gate contact distance. Devices with different gate lengths and gate-drain distances were found to exhibit the onset of degradation at different source-drain biases but similar electric field strengths, showing that the degradation mechanism is primarily field driven. The degradation field was calculated to be similar to 1.8 MV/cm by Automatically Tuned Linear Algebra Software simulations. Transmission electron microscopy imaging showed creation of defects under the gate after dc stress.